Adresář
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

HARWIN
 

Digi-Key Electronics

19.03.2024 0:07:37
bloky
maketa
HomePage
Elektronické součástky
Embedded
Automatizace průmyslu
Bezpečnost
Měřicí technika
Nářadí a pomůcky
Elektromobilita
Solární energie
Osvětlení
Zaměstnání
Veletrhy, výstavy, akce
Online akce
Zajímavé videa
Různé

POLOLU-4980
 
MINIATURNÍ STEP-UP/STEP-DOWN MĚNIČE FIRM
MANSON SDP-2210
 
PROGRAMOVATELNÝ LABORATORNÍ NAPÁJECÍ ZDR
DPI 750E
 
RS Components přidává řadu vylepšených i
SMI200
 
Nový pohled na klasiku: Kompaktní HMI s
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
Sada izolovaných klíčů BAHCO
s-Sense
 
Moduly s-Sense firmy R&D SOFTWARE SOLUTI
LP-RF
 
Panasonic: LP-RF – cenově dostupné laser
TH381
 
Miniaturní těsné svorky řady TH381
TP-1303
 
Dvoukanálové napájecí zdroje Twintex řad


QPL-qualified SupIR-SMD package for rad hard MOSFETs enables higher performing space power systems
Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers.

Too often, different thermal coefficients lead to an expansion mismatch of different materials. IR HiRel, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, solves this issue with fourteen newly QPL-qualified radiation-hardened (rad hard) MOSFETs housed in an innovative direct-to-PCB mounting package. SupIR-SMD is key to higher performing space power systems such as satellite bus power distribution systems, payload power supplies, space-grade DC-DC converters, and other high-switching designs.

Capable of attaching directly to the PCB, the SupIR-SMD design is optimized for surface mount attach and proven to meet the most stringent reliability testing in this configuration, as detailed in IR HiRel’s application note #1222. Compared to the typical packaging solution used in space applications, the SupIR-SMD delivers a 37 percent smaller footprint, 34 percent lighter mass and 33 percent higher current density, while offering a more direct thermal path for heat transfer. “With this, the SupIR-SMD package is testament to IR HiRel’s commitment to deliver innovation that exceeds the specific requirements of the space market,” said Eric Toulouse, Vice-President and General Manager of IR HiRel.

Traditionally, designers resort to a ‘dead bug’ and lead configuration, where the packages are flipped upside down and soldered to the PCB via leads. Dead bug soldering dissipates heat sub-optimally and decreases MOSFET power capacity. Looking forward, system designers can optimize power system efficiency through direct mount of the SupIR-SMD package to the PCB, enabling the shortest thermal conduction path without any compromise in system reliability.

The SupIR-SMD package is JANS-qualified to MIL-PRF-19500. JANS is the most rigorous level of screening and acceptance requirements available to assure the performance, quality and reliability of discrete semiconductors intended for space flight. The new rad hard MOSFETs are also QPL-qualified in accordance with the Qualified Products List (QPL) for space applications.

Availability

The new SupIR-SMD QPL-qualified rad hard MOSFETs can be ordered now with the MIL-PRF-19500 package identifier ‘U2A.’ More information is available at www.infineon.com/supir-smd.


Infineon introduces a new single-stage flyback controller for battery charging applications, enabling hassle-free and scalable designs
Battery-powered appliances, one of the industry’s fastest-growing segments, require energy-efficient, robust, and cost-effective battery charging. For this reason Infineon Technologies AG extends its offering of AC-DC controller ICs by introducing the ICC80QSG single-stage PWM controller for flyback topologies.

Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated quantum processing units (QPUs).

Infineon adds 40 V device in PQFN to its OptiMOS™ Source-Down power MOSFET family
Contemporary power system designs demand high power density levels and small form factors to maximize system-level performance. Infineon Technologies AG tackles this challenge by focusing on system innovation with enhancements on the component level. Adding to the 25 V device introduced in February, Infineon now brings the OptiMOS™ 40 V low-voltage power MOSFET to the market.

QPL-qualified SupIR-SMD package for rad hard MOSFETs enables higher performing space power systems
Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers.

CoolSiC™ MOSFET 1700 V SMD enables best efficiency and reduced complexity for high voltage auxiliary power supplies
Infineon Technologies AG complements its CoolSiC™ MOSFET offering with yet another voltage class. Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology.

Secured connectivity and blockchain technology for data-driven supply chains
Industrial supply chain solutions like digital twins, usage-based pricing models, product warranties or licensing solutions increasingly require reliable and auditable sensor and process data. Yet security is paramount, especially when data is transferred from one company or organization to another.

Safety in cars: Infineon’s AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018

Zajímavé videa


HRY, PC PŘÍSLUŠENSTVÍ A DALŠÍ


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Videoreportáž z veletrhu AMPER 2022


AMPER 2023 - Představujeme vystavovatele... AERS s.r.o.

Firma týdne

BALLUFF


Adresář


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


HARWIN


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA



Kalendář
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813